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电路板加工的蚀刻工序会产生大量含铜蚀刻废液，安全处理与处置含铜蚀刻废液并有效地回收金属是全球可持续发展的迫切需求。本文分析了含铜蚀刻废液的来源、组成及铜赋存特征，重点综述了化学沉淀、金属置换、溶剂萃取、液膜分离、电化学和化学氧化再生等技术的反应机制、关键工艺参数、铜回收效果及尾液处置方式，并总结高值铜基产品的制备进展。从适用废液类型、主要产品、技术成熟度、工艺优势、主要问题、尾液去向及工业化前景等多个维度对含铜蚀刻废液资源化利用技术进行对比，并对制备不同铜基产品的经济性与应用前景进行了分析。最后，结合行业现状与技术发展需求展望了未来应深化构建实际废液数据库并揭示组分迁移机制、推进电路板生产多源含铜废料协同处理与短流程闭路化利用、构建技术经济-环境评价与分级协同利用体系。
Abstract：The etching process used in printed circuit board(PCB) manufacturing generates large quantities of copper-containing spent etching solutions.The safe treatment and disposal of these waste solutions,together with the efficient recovery of valuable metals,are urgent requirements for global sustainable development.This review analyzes the sources,compositions,and copper speciation characteristics of copper-containing spent etching solutions.Particular attention is given to the reaction mechanisms,key operating parameters,copper recovery performance,and residual-liquor management associated with chemical precipitation,cementation,solvent extraction,liquid-membrane separation,electrochemical treatment,and chemical oxidative regeneration.Recent advances in the preparation of high-value-added copper-based products are also summarized.The available resourcerecovery technologies are comparatively evaluated in terms of applicable waste-solution types,major products,technological maturity,process advantages,principal limitations,residual-liquor destinations,and prospects for industrial implementation.The economic feasibility and application potential of producing different copper-based products are further analyzed.Finally,in view of current industrial practices and technological development needs,the following future research directions are proposed.First,databases for actual spent etching solutions should be established,and component migration mechanisms should be clarified.Waste solutions should be classified according to acidic or alkaline systems,the Cu+/Cu2+ ratio,Cl~- or total ammonia concentration,impurity loading,and organic content.The valence-state transformation and decomplexation behavior of copper-chloride and copperammonia complexes,as well as the migration of Fe,Ni,Zn,Pb,Cr,As,Cd,and other impurities during precipitation,extraction,electrowinning,and crystallization,should be elucidated to establish relationships among wastesolution composition,process selection,and product quality.Second,the synergistic treatment and short-process closed-loop utilization of multiple copper-containing waste streams generated during PCB production should be promoted.Copper-containing spent etching solutions,electroplating wastewater,copper-clad laminate offcuts,PCB frame scraps,waste printed circuit boards,and other copper-bearing materials should be managed in an integrated manner.Process coupling and continuous integration should be advanced for routes such as precipitation–residual copper removal–ammonium salt recovery–water reuse,extraction–stripping–electrowinning or crystallization,and electrochemical regeneration–selective copper bleeding.Meanwhile,the coordinated control of organic matter and impurities such as Fe,Ni,Zn,Pb,and Sn should be strengthened to reduce reagent consumption and treatment costs and to achieve the closed-loop recovery of copper,ammonium salts,and water.Third,an integrated technoeconomic–environmental assessment and hierarchical collaborative utilization system should be developed.Using the treatment of a unit quantity of waste solution or the recovery of a unit quantity of copper as the functional unit,resource recovery,reagent and energy consumption,product qualification rate,generation of residual liquor and solid waste,economic benefits,carbon emissions,and other indicators should be comprehensively evaluated.Based on these assessments,an industrial model featuring "priority for on-site closed-loop recycling,supplementary centralized treatment in industrial parks,graded feedstock processing,and product-oriented utilization" should be established.Low-impurity waste solutions should preferentially be converted into electroplating-grade copper sulfate,active copper oxide,or high-purity copper for reuse in PCB production,while quality and environmental standards for regenerated etchants,copper-based products,and by-product salts should be further improved.
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基本信息:
DOI：10.20237/j.issn.1007-7545.2026.09.003
中图分类号:X703;TF811
引用信息:
[1]高宇,王亲猛,宋江珂,等.电路板含铜蚀刻废液资源化利用研究进展[J].有色金属(冶炼部分),2026(09):1838-1866+1781-1782.DOI:10.20237/j.issn.1007-7545.2026.09.003.
基金信息:
国家自然科学基金资助项目(W2411046,52422410,52304375); 国家科技重大专项资助项目(2025ZD0612203)~~
2026-08-28
2026-08-28